TSK UF3000 Spec Sheet

TSK UF3000 was developed to be the de facto standard model for the semiconductor testing process that accurately meets these needs. It is a fully automatic, ultra-high function probing machine that meets the total range of customer requirements including high-mix low-volume production for System LSI etc. or mass production for memories etc.

In addition to the high-rigidity of the machine, the probe mark inspection (PMI) features an automated adjustment sequence to guarantee 100% probe to pad contact.

The UF3000 increases through-put with ease of probe card conversion, quick set-up and improved processing capability. This enables rapid integration into 300mm wafer mass production lines.

Features 1.High through-put The new high performance CPU helps to decrease set up time. Multiple CPUs allow for parallel processing to decrease overall lot process time. 2.Easy Operation Easy conversion of probe cards Easy set up of parameters through new Touch To Go (TTG) function. Also supports multiple languages. Selecting a new language can be done without reboot. New image processing system enables probe to pad alignment, probe mark inspection and self-diagnostic functions. Compliant with 200 mm and 300 mm wafers on one load-port. 3.Ultra precision Probe alignment is conducted at same height as actual probing, thereby minimizing any Z – axis error. For ultra high rigidity, UF3000 uses a 4 axes driving mechanism (QPU: Quad Pot Unit) for Z – axis. OTS (Optical Target Scope) enables measurement of the relative position of the cameras with absolute accuracy. Total Accuracy within ±2µm

Standard Configuration includes: Configured for 8″ or 12″ Wafers 8″ & 12″ Chuck Type (Gold or Nickel) Nickel 3.5″ 20GB Hard Disk 3.5″ 2HD/DD Magneto-Optical Drive Single FOUP Port for 25 Wafers Manual Wafer Inspection Transfer Unit Dual Robotic Wafer Transport Arms Pre-Alignment Stage Unit Auto Needle Alignment Advanced Wafer Alignment Unit Alignment Camera E1-500 Dual (X & Y) Heidenhain Scales Quad-Pod Z Stage Color LCD Control Panel with Touch Panel Switches Alarm Lamp Pole Options: Hot or Cold Chucks Available (TSK or ERS) Wafer ID Options Available (TSK or Cognex) Needle Cleaning Option (Wafer type, Driven Disc type, Stage, Brush) Stage, Wafer Multi-Site Parallel Probing Option (3 to 256 Pins) GPIB Interface Option Ethernet Interface Option ACC (Automatic Probe card Changer) Image Processing Board C8200 Bump Height Settings Option Group Index Option Multi-Pass Probe Option