超全的常用PCB 专业术语 （中英文版）

允许：permit

制造：manufacture

修改：revision

公差：tolerance

忽略：ignore(omit)

工具孔：tooling hole

安装孔：mounting hole

元件孔：component hole

槽孔：slot

邮票孔：snap off hole

导通孔：via

盲孔：blind via

埋孔：buried via

金属化孔：PTH(plating through hole)

非金属化孔：NPTH( no plating through hole)

孔位：hole location

避免：avoid

原设计：original design

修改：modify

按原设计：leave it as it is

附边：waste tab

铜条：copper strip

拼板强度：panel strong

板厚：board thickness

删除：remove(delete)

削铜：shave the copper

露铜：copper exposure

光标点：fiducial mark

不同：be different from(differ from)

内弧：inside radius

焊环：annular ring

单板尺寸：single size

拼板尺寸：panel size

铣：routing

铣刀：router

V-cut：scoring

哑光：matt

光亮的：glossy

锡珠：solder ball(solder plugs)

常用PCB 专业术语

阻焊：solder mask(solder resist)

阻焊开窗：solder mask opening

单面开窗：single side mask opening

补油：touch up solder mask

补线：track welds

毛刺：burrs

去毛刺：deburr

镀层厚度：plating thickness

清洁度：cleanliness

离子污染：ionic contamination

阻燃性：flammability retardant

黑化：black oxidation

棕化：brown oxidation

红化：red oxidation

可焊性：solderability

焊料：solder

包装：packaging

角标：corner mark

特性阻抗：characteristic impedance

正像：positive

负片：negative

镜像：mirror

线宽：conductor width

线距：conductor spacing

做样：build sample

按照：as per

成品：finished

做变更：make the chang

相类似：similar to

规格：specification

下移：shift down

垂直地：vertically

水平的：horizontally

增大：increase

缩小：decrease

表面处理：Surface Finishing

波峰焊：wave solder

钻孔数据：drilling date

标记：Logo Ul

标记：Ul Marking

蚀刻标记：etched marking

周期：date code

翘曲：bow and twist

外层：outer layer

内层：internal layer

顶层：top layer

底层：bottom layer

元件面：component side

焊接面：solder side

阻焊层：solder mask layer

丝印层：legend layer (silkscreen layer or over layer)

兰胶层：peelable SM layer

贴片层：paste mask layer

碳油层：carbon layer

外形层：outline layer(profile layer)

白油：white ink

绿油：green ink

喷锡：hot air leveling (HAL)

水金：flash gold

插头镀金：plated