甘氨酸，丙氨酸和缬氨酸对铜配合物的电化学还原,Journal of The Electrochemical Society

进行了铜离子与作为配体（L）的简单氨基酸（甘氨酸，丙氨酸和缬氨酸）之间的配位配合物的基础电化学研究，以了解配合物对Cu 2+放电电化学的影响。结果表明，尽管它们的配位平衡，中心原子d电子结构和内球配位距离相似（通过化学平衡定量，紫外光谱和EXAFS验证），但它们的循环伏安图仍存在很大差异。中性CuL 2扩散引起的物质传输限制的证据发现溶液中存在络合物，并且在铜电沉积过程中在电极上产生了亚铜物质，这两种事实均被证明是造成上述电化学行为不同的主要现象。伏安研究还表明，令人惊讶的是，不仅在电解铜开始时会产生亚铜，而且阴极电位更高。此外，结果表明在金属铜沉积物下方存在亚铜化合物层。在这项研究中收集的数据得出结论，即更大的分子大小和配体的有机性质引起了铜电还原机理上的意外过程。

"点击查看英文标题和摘要"

Basic electrochemical studies of coordination complexes between cupric ions and simple amino acids as ligands (L), namely glycine, alanine and valine, have been carried out to provide insight in the effect of complexation on Cu2+ discharge electrochemistry. The results show that there are strong differences in their cyclic voltammograms, despite the similarities in coordination equilibrium, central atom d electronic structure and inner sphere coordination distances (verified by chemical equilibrium quantification, UV spectroscopy and EXAFS). Evidence of mass transport limitations by diffusion of the neutral CuL2 complexes in solution, and cuprous species generation on the electrode during copper electrodeposition was found, both of which proved to be the main phenomena accounting for the different electrochemical behaviour previously mentioned. Voltammetric studies also showed that, surprisingly, cuprous species are produced not only at the onset of copper electroreduction but at more cathodic potentials. Furthermore, results suggest the existence of a cuprous compound layer beneath the metallic copper deposit. The data gathered in this investigation, leads to the conclusion that the bigger molecular size and organic nature of the ligands induce unexpected processes on the copper electroreduction mechanism.