深亚PCB

    对于刚进入PCB行业，许多英文缩写就像天书，让人晦涩难懂，因此深亚电子整理了100个PCB中常用的英文缩写、全称及中文名供大家学习：

1.PCB - Printed Circuit Board - 印刷电路板 2.SMT - Surface Mount Technology - 表面贴装技术 3.BGA - Ball Grid Array - 球栅阵列 4.DFM - Design for Manufacturability - 可制造性设计 5.DFT - Design for Testability - 可测试性设计 6.EMI - Electromagnetic Interference - 电磁干扰 7.EMC - Electromagnetic Compatibility - 电磁兼容性 8.HAL - Hot Air Leveling - 热风熔锡 9.HASL - Hot Air Solder Leveling - 热风焊锡平整 10.ICT - In-Circuit Test - 板级测试 11.FCT - Functional Circuit Test - 功能电路测试 12.AOI - Automated Optical Inspection - 自动光学检测 13.X-ray - X-ray Inspection - X射线检测 14.ESD - Electrostatic Discharge - 静电放电 15.LED - Light Emitting Diode - 发光二极管 16.BOM - Bill Of Materials - 物料清单 17.CAD - Computer-Aided Design - 计算机辅助设计 18.CAM - Computer-Aided Manufacturing - 计算机辅助制造 19.CNC - Computer Numerical Control - 计算机数控 20.ROHS - Restriction of Hazardous Substances - 有害物质限制 21.NRE - Non-Recurring Engineering - 非重复工程 22.PTH - Plated Through-Hole - 过孔 23.THT - Through-Hole Technology - 穿孔技术 24.MCPCB - Metal Core Printed Circuit Board - 金属基板印刷电路板 25.HDI - High Density Interconnect - 高密度互连 26.OSP - Organic Solderability Preservatives - 有机钎焊保护剂 27.RF - Radio Frequency - 射频 28.Vias - Vertical Interconnect Access - 垂直互连孔 29.LVDS - Low Voltage Differential Signaling - 低压差分信号传输 30.EDA - Electronic Design Automation - 电子设计自动化 31.FPC - Flexible Printed Circuit - 柔性印刷电路板 32.IPC - Institute for Printed Circuits - 印制电路协会 33.LGA - Land Grid Array - 焊盘阵列 34.MCM - Multi-Chip Module - 多芯片模块 35.DDR - Double Data Rate - 双倍数据传输率 36.RAM - Random Access Memory - 随机存取存储器 37.ROM - Read-Only Memory - 只读存储器 38.TDR - Time Domain Reflectometry - 时域反射法 39.DRC - Design Rule Check - 设计规则检查 40.VRM - Voltage Regulator Module - 电压调节模块 41.PBC - Polychlorinated Biphenyls - 多氯联苯 42.PWM - Pulse Width Modulation - 脉宽调制 43.LPI - Liquid Photo-Imageable - 液体感光油墨 44.ERP - Enterprise Resource Planning - 企业资源规划 45.CRM - Customer Relationship Management - 客户关系管理 46.CAD/CAM - Computer-Aided Design/Computer-Aided Manufacturing - 计算机辅助设计/制造 47.DIP - Dual In-line Package - 双列直插封装 48.IC - Integrated Circuit - 集成电路 49.FPGA - Field Programmable Gate Array - 现场可编程门阵列 50.ASIC - Application-Specific Integrated Circuit - 特定应用集成电路 51.RD - Research and Development - 研发 52.EDA - Electronic Design Automation - 电子设计自动化 53.CEM - Contract Electronics Manufacturer - 合同电子制造商 54.PWB - Printed Wiring Board - 印刷布线板 55.P&P - Pick and Place - 取放设备 56.SMD - Surface Mount Device - 表面贴装器件 57.MSL - Moisture Sensitivity Level - 湿敏等级 58.OEE - Overall Equipment Effectiveness - 设备综合效率 59.RFQ - Request for Quotation - 报价请求 60.PMS - Process Management System - 过程管理系统 61.ESD - Electrostatic Discharge - 静电释放 62.PNP - Positive-Negative-Positive - 正负正结构 63.SPC - Statistical Process Control - 统计过程控制 64.SMTA - Surface Mount Technology Association - 表面贴装技术协会 65.UL - Underwriters Laboratories - 安捷伦实验室 66.WIP - Work in Progress - 在制品 67.COB - Chip on Board - 芯片贴片 68.DIP - Dual Inline Pin - 双列直插引脚 69.FIFO - First In, First Out - 先进先出 70.GND - Ground - 地线 71.IPQC - In-Process Quality Control - 过程中的质量控制 72.LCR - Leadless Chip Resistor - 无引线片式电阻 73.MTBF - Mean Time Between Failures - 故障平均时间间隔 74.NPI - New Product Introduction - 新产品导入 75.PCBA - Printed Circuit Board Assembly - 印刷电路板组装 76.PPM - Parts Per Million - 百万分之一 77.QFN - Quad Flat No-Leads - 方形无引脚封装 78.RMA - Return Merchandise Authorization - 退货授权 79.SPC - Statistical Process Control - 统计过程控制 80.THT - Through-Hole Technology - 穿孔技术 81.TRM - Technical Reference Manual - 技术参考手册 82.UPS - Uninterruptible Power Supply - 不间断电源 83.VPP - Verification and Production Prototype - 验证和生产原型 84.WEEE - Waste Electrical and Electronic Equipment - 废弃电子电器设备 85.PPF - Process Performance Factor - 工艺性能因子 86.PNP - Positive-Negative-Positive - 正-负-正结构 87.UUT - Unit Under Test - 被测单元 88.ZIF - Zero Insertion Force - 零插入力 89.Cpk - Process Capability Index - 过程能力指数 90.CP - Control Plan - 控制计划 91.FMEA - Failure Mode and Effects Analysis - 失效模式和效应分析 92.Gage R&R - Gauge Repeatability and Reproducibility - 量具重复性和再现性 93.LCA - Life Cycle Assessment - 生命周期评估 94.SMT - Surface Mount Technology - 表面贴装技术 95.DFT - Design for Testability - 可测试性设计 96.CEM - Contract Electronics Manufacturer - 合同电子制造商 97.BOM - Bill Of Materials - 物料清单 98.COB - Chip on Board - 芯片贴片 99.FMEA - Failure Mode and Effects Analysis - 失效模式和效应分析 100.LCA - Life Cycle Assessment - 生命周期评估

        以上是深亚电子整理的一些在 PCB 领域中常见的英文缩写及其全称，希望对你有所帮助。 

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