Defect Inspection & Review

The C30x broadband plasma inspectors include the following technologies:

With a high brightness DUV/UV/visible light source, the C30x Series inspectors attain increased signal to critical defects.

Numerous wavelength bands offer the operational flexibility required to achieve optimal contrast for different process layers and device types.

The C30x includes small pixel sizes, enabling detection of the tiny, critical defects that affect device yield and reliability.

With a low noise, high data rate sensor, the C30x achieves high speed operation, enabling fabs to increase their inspection capacity.

Multiple apertures on the C30x provide enhanced nuisance suppression, enabling detection of defects in challenging die areas.

NanoPoint technology focuses inspection on micro pattern care areas at high risk for reliability failures, delivering actionable defect data that helps reduce die under/overkill.

Custom defect detection algorithms suppress noise related to pattern or process variations, increasing capture of critical yield and reliability defects.

Through real time binning of defects, the C30x Series accelerates time to an actionable defect Pareto and helps fab engineers focus on the most critical defect issues.